Results 1-2 of 2 (Search time: 0.006 seconds).
NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
---|---|
Study of drop-performance improved lead-free solder by PCB pad finish Lee, YW; Lee, JH; Moon, JT; Park, YS; Paik, Kyung-Wook, 2009 11th Electronic Packaging Technology Conference, EPTC 2009, pp.668 - 672, 2009-12-09 | |
Effects of fine size lead-free solder ball on the interfacial reactions and joint reliability Park, YS; Kwon, YM; Moon, JT; Lee, YW; Lee, JH; Paik, Kyung-Wook, 2009 11th Electronic Packaging Technology Conference, EPTC 2009, pp.321 - 324, 2009-12-09 |
Discover