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Results 41-50 of 119 (Search time: 0.003 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Epoxy/BaTiO3 (SrTiO3) composite films for high dielectric constant and low tolerance embedded capacitors fabrication in organic substrates Paik, Kyung-Wook; Cho, SD; Hyun, JG; Lee, S; Kim, H; Kim, J, 2005 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, v.2005, pp.227 - 232, 2005-03-16 | |
| Study of drop-performance improved lead-free solder by PCB pad finish Lee, YW; Lee, JH; Moon, JT; Park, YS; Paik, Kyung-Wook, 2009 11th Electronic Packaging Technology Conference, EPTC 2009, pp.668 - 672, 2009-12-09 | |
| Patterning of wafer level applied non-conductive adhesives (NCAs) for camera image sensor (CIS) modules Kim, I; Son, HY; Paik, Kyung-Wook, 2009 59th Electronic Components and Technology Conference, ECTC 2009, pp.1806 - 1810, 2009-05-26 | |
| Fabrication and characterization of embedded capacitors in printed circuit boards using B-stage epoxy/BaTiO3 composite embedded capacitor films (ECFs) Lee, S; Hyun, JG; Pak, JS; Lee, H; Jeon, HS; Paik, Kyung-Wook, 2008 58th Electronic Components and Technology Conference, ECTC, pp.742 - 746, 2008-05-27 | |
| Reliability enhancement of embedded capacitors in printed circuit boards using b-stage epoxy/batio3 composite embedded capacitor films (ECFS) Lee, S; Jang, JM; Lee, WS; Paik, Kyung-Wook, 2009 59th Electronic Components and Technology Conference, ECTC 2009, pp.771 - 776, 2009-05-26 | |
| Studies on the thermal cycling reliability of fine pitch Cu/SnAg double-bump flip chip assemblies on organic substrates: Experimental results and numerical analysis Son H.-Y.; Kim I.; Park J.-H.; Lee S.-B.; Jung G.-J.; Park B.-J.; Paik, Kyung-Wook, 2008 58th Electronic Components and Technology Conference, ECTC, pp.2035 - 2043, 2008-05-27 | |
| 플립칩 접속을 위한 비전도성 필름 (NCFs)의 관능기가 물질 특성 및 신뢰성에 미치는 영향 Paik, Kyung-Wook, 한국마이크로전자 및 패키징 학회, pp.37 - 44, 한국마이크로전자 및 패키징 학회, 2005-11-01 | |
| Fabrication and characterization of epoxy/bari0 composite embedded capacitor for high frequency behaviors Hyun, JG; Paik, Kyung-Wook; Pak, JS, 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008, pp.124 - 128, 2008-10-22 | |
| Novel Wafer Level Packages Using Anisotropic Conductive Pastes (ACPs) and NCPs Paik, Kyung-Wook; Kim, Il; Son, Ho-Young; Chung, Chang-Kyu, Novel Wafer Level Packages Using Anisotropic Conductive Pastes (ACPs) and NCPs, pp.0 - 0, 2008 | |
| 20 µm-pitch complaint-bump-bonded chip-on-flex by pre-applied wafer level adhesives Chuang, CC; Lu, ST; Chang, TC; Suk, KL; Paik, Kyung-Wook, IMPACT Conference 2009 International 3D IC Conference, pp.56 - 59, 2009-10-21 |