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Results 21-30 of 119 (Search time: 0.006 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Anisotropic Conductive Films (ACFs) for ultra-fine Pitch Chip-On-Glass (COG) applications Yim, MJ; Hwang, J; Paik, Kyung-Wook, 2005 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, v.2005, pp.181 - 186, 2005-03-16 | |
| Formation of Pb/63Sn Solder Bumps using a Solder Droplet Jetting Method Son, HY; Gam, SA; Paik, Kyung-Wook, Formation of Pb/63Sn Solder Bumps using a Solder Droplet Jetting Method, pp.147 - 152, 2004-12 | |
| Bubbles formation in rigid-flexible substrates bonding using Anisotropic Conductive Films (ACFs) and their effects on ACFs joints reliability Kim, HJ; Hong, SM; Jang, SY; Moon, YJ; Paik, Kyung-Wook, 7th Electronics Packaging Technology Conference, 2005, v.2, pp.734 - 739, 2005-12-07 | |
| A Study on Copper-to-Copper Contacts in NMBITM(Neo-Manthattna Bump Interconnection Structure) Kim, HJ; Paik, Kyung-Wook; Lee, SG; Han, JW; Hwang, JH; Lee, SM, 6th International Conference on Electronic Materials and Packaging, pp.0 - 0, 2004-12-01 | |
| Effects of the polymer residues on via contact resistance after reactive ion etching Ko, HS; Nah, JW; Paik, Kyung-Wook; Park, Y, 20th North American Conference on Molecular Beam Epitaxy, v.20, no.3, pp.1000 - 1007, 2001-10-01 | |
| Epoxy/BaTio3 (SrTiO3) Composite Films and Pastes for Organic Substrates Applications Paik, Kyung-Wook, UKC 2006 (US-Korea Conference on Science, Technology, and Entrepreneurship), pp.0 - 0, 2006-08-01 | |
| Effects of Electrical Current on the Failure Mechanisms of Au stud bumps/ACF Flip Chip Joints under High Current Stressing Condition Kim, HJ; Kwon, WS; Paik, Kyung-Wook, 5th International Conference on Electronic Materials and Packaging, pp.203 - 208, 2003-11 | |
| Study on the properties of Epoxy/BaTiO3 Composite Embedded Capacitor Films for Organic Substrate Cho, SD; Hyun, JG; Paik, Kyung-Wook, 5th International Conference on Electronic Materials and Packaging, pp.20 - 26, 2003-11 | |
| Electrical conducting behavior of hybrid nanocomposites containing carbon nanotubes and carbon black Ma, PC; Zhang, H; Wang, SQ; Wong, YK; Tang, BZ; Hong, SH; Paik, Kyung-Wook; Kim, JK, The 9th International Conference on Electronic Materials and Packaging, EMAP 2007, pp.0 - 0, 2007-11-19 | |
| Anisotropic Conductive Adhesives Flip Chip Technology Paik, Kyung-Wook, Asymtek & Tsinghua University Workshop, pp.0 - 0, 2001-05-01 |