Results 1-1 of 1 (Search time: 0.005 seconds).
NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
---|---|
Wafer level ACA packages and their applications to advanced electronic packaging Paik, Kyung-Wook; Son, HY; Kim, I; Chung, CK, 10th Electronics Packaging Technology Conference, EPTC 2008, pp.450 - 456, 123, 2008-12-09 |
Discover