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Results 11-19 of 19 (Search time: 0.008 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Experimental Analysis of Compressive Stresses in ACF Flip Chip Joint and Its Influence on ACF Joint Reliability Kwon, WS; Paik, Kyung-Wook, 2003 International Electronic Packaging Technical Conference and Exhibition, v.1, pp.131 - 136, 2003-07-06 | |
| High Reliable Non-Conductive Adhesives for Flip Chip CSP Applications Yim, MJ; Hwang, JS; Kwon, WS; Jang, KW; Paik, Kyung-Wook, 2002 Electronic Components & Technology Conference , pp.1385 - 1389, 2002 Electronic Components & Technology Conference, 2002-05-28 | |
| High current induced failure of ACAs flip chip joint Kwon, WS; Paik, Kyung-Wook, 52nd Electronic Components and Technology Conference, pp.1130 - 1134, IEEE, 2002-05-28 | |
| UBM (Under Bump Metallization) study for Pb-free electroplating bumping: Interface reaction and electromigration Jang, SY; Wolf, J; Kwon, WS; Paik, Kyung-Wook, 52nd Electronic Components and Technology Conference, pp.1213 - 1220, IEEE, 2002-05-28 | |
| Internal stresses evolution of non conductive pastes (NCPs) and underfill materials for flip chip applications Jang, KW; Kim, HJ; Kwon, WS; Paik, Kyung-Wook, 55th Electronic Components and Technology Conference, ECTC, pp.1486 - 1490, IEEE, 2005-05-31 | |
| The experimental and theoretical approaches of contraction stress build-up of anisotropic conductive adhesives for flip chip interconnection Kwon, WS; Yang, SY; Lee, Soon-Bok; Paik, Kyung-Wook, 55th Electronic Components and Technology Conference, ECTC, pp.1468 - 1474, IEEE, 2005-05-31 | |
| The effect of Tg on thermo-mechanical deformation and reliability of adhesive flip chip assemblies during temperature cycling Kwon, WS; Yang, SY; Lee, Soon-Bok; Paik, Kyung-Wook, Proceedings - 54th Electronic Components and Technology Conference, pp.1731 - 1737, IEEE, 2004-06-01 | |
| Significant Reliablity Enhancement Using New Anisotropic Conductive Adhesives for Flip Chip on Organic Substrates Applications Paik, Kyung-Wook; Kwon, WS; Yim, MJ, 2001 Pan Pacific Microelectronics Symposium, pp.217 - 223, Pan Pacific Microelectronics Symposium, 2001-02-01 | |
| In-situ moiré measurement of adhesive flip-chip bonded assembly under thermal cycling condition Ham, SJ; Kwon, WS; Paik, Kyung-Wook; Lee, Soon-Bok, 2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, pp.63 - 67, IEEE, 2002-06 |