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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| High Reliable Nong-Conductive Adhesives for Flip Chip Interconnections Kwon, WS; Jang, KW; Paik, Kyung-Wook, 3rd International Symposium on Electronic Materials and Packagings 2001, pp.34 - 38, 2001-11 | |
| Microwave characterization and comparison of adhesive flip chip interconnects Kwon, WS; Jeon, YD; Lee, JH; Nah, JW; Yim, MJ; Paik, Kyung-Wook, Pacific Rim/International, Intersociety Electronic Packaging Technical/Business Conference and Exhibition, v.1, pp.273 - 278, 2001-07-08 | |
| Anisotropic Conductive Film for Fine Pitch COG (Chip-on-Glass) Technology Application Yim, MJ; Kwon, WS; Paik, Kyung-Wook, The 5th Korea-Japan International Symposium on Liquid Crystalline Materials and Devices, pp.64 - 65, 2001-05-01 | |
| Reliable Anisotropic Conductive Adhesives Flip Chip Technology on Organic Substrates for High Frequency Applications Paik, Kyung-Wook; Yim, MJ; Kwon, WS, The 6th International Symposium on Microelectronics and Packaging, pp.0 - 0, 2001-04-01 | |
| Significant Reliablity Enhancement Using New Anisotropic Conductive Adhesives for Flip Chip on Organic Substrates Applications Paik, Kyung-Wook; Kwon, WS; Yim, MJ, 2001 Pan Pacific Microelectronics Symposium, pp.217 - 223, Pan Pacific Microelectronics Symposium, 2001-02-01 |
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