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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| High Reliable Nong-Conductive Adhesives for Flip Chip Interconnections Kwon, WS; Jang, KW; Paik, Kyung-Wook, 3rd International Symposium on Electronic Materials and Packagings 2001, pp.34 - 38, 2001-11 | |
| High Reliable Non-Conductive Adhesives for Flip Chip CSP Applications Yim, MJ; Hwang, JS; Kwon, WS; Jang, KW; Paik, Kyung-Wook, 2002 Electronic Components & Technology Conference , pp.1385 - 1389, 2002 Electronic Components & Technology Conference, 2002-05-28 | |
| Internal stresses evolution of non conductive pastes (NCPs) and underfill materials for flip chip applications Jang, KW; Kim, HJ; Kwon, WS; Paik, Kyung-Wook, 55th Electronic Components and Technology Conference, ECTC, pp.1486 - 1490, IEEE, 2005-05-31 |
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