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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Highly Reliable Flip Chip on Flex Package using Multi-layered Anisotropic Conductive Film Yim, MJ; Hwang, JS; Kim, JG; Ahn, JY; Kim, HJ; Kwon, WS; Paik, Kyung-Wook, Proceeding of the 3rd International Symposium on Electronic Materials and Packaging 2002, pp.0 - 0, 2002-12 | |
| High Reliable Non-Conductive Adhesives for Flip Chip CSP Applications Yim, MJ; Hwang, JS; Kwon, WS; Jang, KW; Paik, Kyung-Wook, 2002 Electronic Components & Technology Conference , pp.1385 - 1389, 2002 Electronic Components & Technology Conference, 2002-05-28 |
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- 2 2002