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NO Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
1
Effects of Electrical Current on the Failure Mechanisms of Au stud bumps/ACF Flip Chip Joints under High Current Stressing Condition

Kim, HJ; Kwon, WS; Paik, Kyung-Wook, 5th International Conference on Electronic Materials and Packaging, pp.203 - 208, 2003-11

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