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NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
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Effects of heating rate during ACFs curing process on material properties and thermal cycling reliability of flip chip assembly Jang, KW; Paik, Kyung-Wook, 57th Electronic Components and Technology Conference, 2007, pp.1725 - 1730, IEEE, 2007-05-29 | |
Effects of Anisotropic Conductive Film (ACF) viscosity on ACF fillet and moisture-related reliability for Flip-chip-on-board (FCOB) packages Jang, KW; Paik, Kyung-Wook, The 9th International Conference on Electronic Materials and Packaging 2007, EMAP 2007, pp.0, 123, 2007-11-19 |
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