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NO Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
1
Internal stresses evolution of non conductive pastes (NCPs) and underfill materials for flip chip applications

Jang, KW; Kim, HJ; Kwon, WS; Paik, Kyung-Wook, 55th Electronic Components and Technology Conference, ECTC, pp.1486 - 1490, IEEE, 2005-05-31

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