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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Wafer level packages (WLPs) using anisotropic conductive adhesives (ACAs) solution for flip-chip interconnections Kim, I; Jang, KW; Son, HY; Kim, JH; Paik, Kyung-Wook, 2008 58th Electronic Components and Technology Conference, ECTC, pp.219 - 224, 2008-05-27 | |
| Epoxy/BaTiO3 composite films and pastes for high dielectric constant and low tolerance embedded capacitors fabrication in organic substrates Hyun, JG; Jang, KW; Cho, SD; Paik, Kyung-Wook; Kim, HS; Kim, JH, 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, pp.105 - 111, 2004-09-12 |
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