1 | Development of low temperature bonding using in-based solders Choi, WK; Yu, D; Lee, C; Yan, L; Yu, A; Yoon, SW; Lau, JH; Cho, MG; Jo, YH; Lee, Hyuck Mo, 2008 58th Electronic Components and Technology Conference, ECTC, pp.1294 - 1299, 2008-05-27 |
5 | Controlling the interfacial reactions in Pb-free interconnections by adding minor alloying elements to Sn-rich solders Kang, SK; Cho, MG; Shih, DY; Seo, SK; Lee, Hyuck Mo, 2008 58th Electronic Components and Technology Conference, ECTC, pp.478 - 484, 2008-05-27 |