Browse "MS-Conference Papers(학술회의논문)" by Title 

Showing results 4021 to 4040 of 7321

4021
Microstructural characterization of InGaN/GaN MQWs with different quantum well number

Lee, Jeong Yong, The 10th Korean Conference on Semiconductors, pp.759 - 760, 2003-02-01

4022
Microstructural Characterization of SA508 Gr.4N Low Alloy Steel with Vaious Ni Contents

Wee, Dang-Moon; Lee, KH; Kim, MC; Lee, BS, International Conference on Pressure Vessel Technology, pp.124 - 131, 2009

4023
Microstructural Control of Mechanically Alloyed Tungstyen Heavy Alloy by Two-step Sintering

Hong, Soon-Hyung; Ryu, HJ; Baek, WH, PM 98 World Congress, pp.520 - 520, 1998-01-01

4024
Microstructural Dependence on the Stress-Corrosion Behaviour of Commercial Al-Zn-Mg-Cu Alloy (AA 7075) by Constant Strain-Rate Test Method

변수일, Korean Corros. Sci. Soc., pp.11 - 11, 1985

4025
Microstructural Design by Control of Grain Boundary Structure

Kang, Suk-Joong L; Choi, SY, Trans Tech Pub, pp.3891 - 3896, 2005

4026
Microstructural Design of Polycrystals via Control of Interface Structure

Kang, Suk-Joong L, PM-07 International Conference with Exhibition, Feb. 8-11 (2007), ., 2007-02-08

4027
Microstructural evolution during high temperature deformation of Ti-47Al-2Cr-4Nb intermetallic compound

Kim Hee Y.; Sohn Woong H.; Hong, Soon-Hyung, Proceedings of the 1997 TMS Annual Meeting, pp.195 - 205, 1997-02-09

4028
Microstructural Evolution in Ceramics by Structural Transition at Interfaces

Kang, Suk-Joong L, 33rd Inter. Conference and Exhibition on Advanced Ceramics and Composites, The American Ceramic Society, 2009-01-18

4029
Microstructural Evolution in Ceramics with Control of the Interface Structure

Kang, Suk-Joong L, 1st Eurasia Ceramic Congress, Eurasia Ceramic Congress, 2010-10-06

4030
Microstructural Evolution in Polycrystalline Materials with Control of the Interface Structure

Kang, Suk-Joong L, 20th Anniversary Symposium of MRS-Japan, MRS-Japan, 2009-12-06

4031
Microstructural Evolution of Hot Isostatic Pressed Titanium Alloy Components

Kim Youngmoo; Kim Eun-Pyo; Lee Sung Ho; Chung Seong-Taek; Kwon Young-Sam; Hong, Soon Hyung, 2014 World congress on powder metallurgy and particulate materials, 2014 World congress on powder metallurgy and particulate materials, 2014-05

4032
Microstructural improvement in polycrystalline Si films by crystallizing with vapor transport of Al/Ni chlorides

Ahn, Byung Tae, International Meeting on Information Display, pp.0 - 0, 2004-08-01

4033
Microstructural Investigation of AuGe/Ni Ohmic Contact to Ion-Implanted n-GaAs

Lee, Jeong, Yong, Proc. Kor. Inst. Telem. Elect. on Semicon., Mater., pp.267 - 267, 1989-12-01

4034
Microstructural properties of [0001]-tilt grain boundaries at triple junctions in ZnO thin films grown on Si substrates

Lee, Jeong Yong, IUMRS-ICA, 2006-09-10

4035
Microstructural properties of closely stacked InAs quantum dots inserted in GaAs layers embedded in modulation-doped Al0.25Ga0.75As/GaAs heterostructures

이정용, 제8회 한국반도체학술대회, pp.579 - 580, KCS, 2001-02

4036
Microstructural Property Variations in ZnO Nanowires Formed on Indium-tin-oxide Film Coated Glass Substrates due to an Embedded ZnO Buffer Layer

Lee, Jeong Yong, 2009 GJ-NST International Conference on Nano Science and Nano Technology, 2009-11-05

4037
Microstructural study of polycrystalline films prepared by Ni vapor induced crystallization

Ahn, Kyung Min; Lee, Kye Ung; Ahn, Byung Tae, IMID/IDMC 2006: 6th Internaional Meeting on Information Display and the 5th International Display Manufacturing Conference, pp.715 - 717, 2006-08-22

4038
Microstructural Study on Mechanical Properties of MEMS Materials

Hong, Soon Hyung, Spring Meeting of The Korean Society of Mechanical Engineers, 2005-05-26

4039
Microstructural transition and Grading Phenomena of CIGS Film by Sputtering and Selenization Process with a Novel Approach

Ahn, Byung Tae, 한국신재생에너지학회 추계학술대회, 2007-11-06

4040
Microstructural Transition of Cu(In,Ga)Se2 Film by Sputtering and Selenization Process with a Novel Approach

Ahn, Byung Tae, 22-European PVSEC, 2007-09-03

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