| 1801 | Effect on Co Addition on Undercooling,Microstuctures and Mircohardness of Sn-3.5Ag Solder and Interfacial Reations with Ni-P UBM Lee, Hyuck Mo, 137th TMS Annual Meeting, 2008-03-11 |
| 1802 | Effect on Preannealing on the Stress-Rupture Property in Mechanically Alloyed ODS Ni-Base Superalloy Hong, Soon-Hyung; Park, LJ; Kim, YG; Haeberle, RM; Watwe, AS, Proceeding of 2nd Asia Pacific International Conference on Advanced Materials of Processing, pp.2379 - 2384, 1995 |
| 1803 | Effect on the doped metal of CNT/MEH-PPV photovoltaic cell Hong, Soon-Hyung, Spring Meeting of The Korean Physical Society, pp.39 - 39, 한국물리학회, 2008-04-17 |
| 1804 | Effect on the Particle size of Ceramics for the Piezoelectic of PZT 김호기, The Korean Ceramic Society Epoxy Composite, Kor.Inst.Elect.Eng.,spring meeting, 1987 |
| 1805 | Effect oof Bottom Electrode on the Ferroelectric Property of Sputtered BaTiO3 Thin Films 최시경; 조영우, 한국세라믹학회, pp.87 -, 2002 |
| 1806 | Effectds of Shape and Misalignment of Reinforcement on Load Transfer Efficiency of Metal Matrix Composites 홍순형; Ryu, HJ; Chung, KH, Spring Meeting of the Korean Society for Composite Materials, pp.61 - 64, 한국복합재료학회, 1998 |
| 1807 | Effective Passivation of Nano-sized Electrode Materials Pursuing High Stability and Activity using in situ chemical vapor deposition 김찬훈; 김일두, 대한금속 재료학회 춘계학술대회, 대한금속 재료학회, 2018-04-26 |
| 1808 | Effects of 211 Inclsions on Directionally Melt-Textured (Sm/Y)-Ba-Cu-O Composite High Tc Superconductors Ho-Gi Kim, , 1999-01-01 |
| 1809 | Effects of 211 Inclusions on Sm-doped Bulk Type YBCO High Tc Superconductor Ho-Gi Kim, , 1999-01-01 |
| 1810 | Effects of a-Alumina Content on the Ionic Conduction Characteristics of Lithium Iodide/a-Alumina Solid Electrolyte 변수일, Korean Corros. Sci. Soc., pp.58 - 59, 1990 |
| 1811 | Effects of ACFs adhesion on the bending reliability of Chip-in-Flex Packages for Wearable Electronics Applications Kim, Ji Hye; Lee, Tae Ik; Kim, Taek Soo; Paik, Kyung Wook, IEEE 66th Electronic Components and Technology Conference, pp.2461 - 2467, IEEE 66th Electronic Components and Technology Conference, 2016-06-02 |
| 1812 | Effects of ACFs Modulus and Adhesion Strength on the Bending Reliability of CIF(Chip-in-Flex) Packages at Humid Environment Kim, Jihye; Lee, Tae-Ik; Kim, Taek-Soo; Paik, Kyung-Wook, 68th IEEE Electronic Components and Technology Conference (ECTC), pp.2319 - 2325, IEEE-CPMT, 2018-05-31 |
| 1813 | Effects of Acid Leaching Post-Treatment Process on the Structural Stability of Pt-Based Intermetallic Catalysts for Fuel Cell Applications Yang, HyunWoo; Lee, KwangHo; Cho, Eun Ae, The 243rd ECS Meeting, The Electrochemical Society, 2023-05-28 |
| 1814 | Effects of additives on the defects of electroplated copper via in 3D SiP Lee, Won-Jong; Cho, BH; Jang, GH, UMRS-ICA-2006, 2006-09-10 |
| 1815 | Effects of Aging at 475 ℃ on the Localized Corrosion of W-Containing Duplex Stainless Steels Kwon, Hyuk-Sang, pp.870 - 879, 1999-01-01 |
| 1816 | Effects of Aging on the Hydrogen Embrittlement of HSLA-100 Steels in an Acidified Synthetic Sea Water Kwon, Hyuk-Sang; Cho, KC; Kim, JS, Proceedings of the 9th Asian-Pacific Corrosion Control Conference, pp.309 - 314, 1995 |
| 1817 | Effects of Alignment of Graphene Flakes on Water Permeability of Graphene -epoxy Composite Film 정승윤; Paik, Kyung-Wook, The 64th Electronic Components and Technology Conference, The 64th Electronic Components and Technology Conference, 2014-05-31 |
| 1818 | Effects of Alloy Composition (Ag, Cu, Ni, Zn) and Cooling Rate on Microstructure and Microhardness of Sn-based Solders Lee, Hyuck Mo, Korean Journal of Metal and Materials, 2008-04-25 |
| 1819 | Effects of Alloying Elements (Cr, Mo, Ni) on Repassivation Kinetics of Ferritic Stainless Steels Cho, Eun-Ae; Kim, JK.; Kim, JS.; Kwon, HS., Stainless Steel '99 - Science and Market, Stainless Steel '99 - Science and Market, 1999-06-06 |
| 1820 | Effects of Alloying Elements (Cr, Mo, Ni) on Repassivation Kinetics of Ferritic Stainless Steels Cho, Eun-Ae; Kim, JS.; Kwon, HS., International Symposium on the Passivity of Metals and Semiconductors, International Symposium on the Passivity of Metals and Semiconductors, 1999-05-09 |
