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A highly bendable thin film encapsulation by the modulation of thermally induced interfacial residual stress

Park, Yong Cheon; Kim, Taehyun; Shim, Hye Rin; Choi, YoungWoo; Hong, Seungbum; Yoo, Seunghyup; Im, Sung Gap, APPLIED SURFACE SCIENCE, v.598, 2022-10

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