DC Field | Value | Language |
---|---|---|
dc.contributor.author | Ryu, C. | ko |
dc.contributor.author | Chung, D. | ko |
dc.contributor.author | Bae, K. | ko |
dc.contributor.author | Yu, J. | ko |
dc.contributor.author | Kim, Joungho | ko |
dc.date.accessioned | 2007-06-21T01:20:21Z | - |
dc.date.available | 2007-06-21T01:20:21Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2004-10-25 | - |
dc.identifier.citation | IEEE 13th Topical Meeting on Electrical Performance of Electronic Packaging, pp.291 - 294 | - |
dc.identifier.uri | http://hdl.handle.net/10203/588 | - |
dc.language | English | - |
dc.language.iso | en_US | en |
dc.publisher | IEEE | - |
dc.title | Implementation of low jitter clock distribution using chip-package hybrid interconnection | - |
dc.type | Conference | - |
dc.identifier.wosid | 000225765800069 | - |
dc.identifier.scopusid | 2-s2.0-15944396936 | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 291 | - |
dc.citation.endingpage | 294 | - |
dc.citation.publicationname | IEEE 13th Topical Meeting on Electrical Performance of Electronic Packaging | - |
dc.identifier.conferencecountry | US | - |
dc.identifier.conferencelocation | Portland, OR | - |
dc.embargo.liftdate | 9999-12-31 | - |
dc.embargo.terms | 9999-12-31 | - |
dc.contributor.localauthor | Kim, Joungho | - |
dc.contributor.nonIdAuthor | Ryu, C. | - |
dc.contributor.nonIdAuthor | Chung, D. | - |
dc.contributor.nonIdAuthor | Bae, K. | - |
dc.contributor.nonIdAuthor | Yu, J. | - |
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