Performance of a Conduction Cooling Module
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Song, Tae-Ho | ko |
| dc.contributor.author | Bang | ko |
| dc.date.accessioned | 2013-02-25T01:02:51Z | - |
| dc.date.available | 2013-02-25T01:02:51Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 1990 | - |
| dc.identifier.citation | JOURNAL OF ELECTRONIC PACKAGING, v.112, pp.52 - 56 | - |
| dc.identifier.issn | 1043-7398 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/58601 | - |
| dc.language | English | - |
| dc.publisher | Asme-Amer Soc Mechanical Eng | - |
| dc.title | Performance of a Conduction Cooling Module | - |
| dc.type | Article | - |
| dc.type.rims | ART | - |
| dc.citation.volume | 112 | - |
| dc.citation.beginningpage | 52 | - |
| dc.citation.endingpage | 56 | - |
| dc.citation.publicationname | JOURNAL OF ELECTRONIC PACKAGING | - |
| dc.contributor.localauthor | Song, Tae-Ho | - |
| dc.contributor.nonIdAuthor | Bang | - |
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