A Fracture Mechanics Approach on Delamination and Package Crack in Electronic Packaging: I. Delamination
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 엄윤용 | ko |
| dc.date.accessioned | 2013-02-24T13:32:26Z | - |
| dc.date.available | 2013-02-24T13:32:26Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 1994-01 | - |
| dc.identifier.citation | 대한기계학회논문집, v.18, pp.2139 - 2157 | - |
| dc.identifier.issn | 1226-4873 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/57490 | - |
| dc.language | Korean | - |
| dc.publisher | 대한기계학회 | - |
| dc.title | A Fracture Mechanics Approach on Delamination and Package Crack in Electronic Packaging: I. Delamination | - |
| dc.type | Article | - |
| dc.type.rims | ART | - |
| dc.citation.volume | 18 | - |
| dc.citation.beginningpage | 2139 | - |
| dc.citation.endingpage | 2157 | - |
| dc.citation.publicationname | 대한기계학회논문집 | - |
| dc.contributor.localauthor | 엄윤용 | - |
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