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College of Engineering(공과대학)School of Electrical Engineering(전기및전자공학부)EE-Conference Papers(학술회의논문)

Analysis of coupling suppression methods on split power/ground planes using embedded capacitor in multi-layered package

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dc.contributor.authorJeong, Y.ko
dc.contributor.authorLu, A.C.W.ko
dc.contributor.authorWai, L.L.ko
dc.contributor.authorFan, W.ko
dc.contributor.authorLok, B.K.ko
dc.contributor.authorKim, Jounghoko
dc.date.accessioned2007-06-20T06:55:18Z-
dc.date.available2007-06-20T06:55:18Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued2004-06-01-
dc.identifier.citation2004 Proceedings - 54th Electronic Components and Technology Conference, pp.575 - 580-
dc.identifier.issn0569-5503-
dc.identifier.urihttp://hdl.handle.net/10203/569-
dc.description.sponsorshipAuthors would like to acknowledge the collaborative research project funding and support from Singapore Institute of Manufacturing Technology, A*STAR, and Korea Advanced Institute of Science and Technology, Terahertz Media and System Laboratory (Dept of EE and CS).en
dc.languageEnglish-
dc.language.isoen_USen
dc.publisherIEEE-
dc.titleAnalysis of coupling suppression methods on split power/ground planes using embedded capacitor in multi-layered package-
dc.typeConference-
dc.identifier.wosid000224340900089-
dc.identifier.scopusid2-s2.0-10444252517-
dc.type.rimsCONF-
dc.citation.beginningpage575-
dc.citation.endingpage580-
dc.citation.publicationname2004 Proceedings - 54th Electronic Components and Technology Conference-
dc.identifier.conferencecountryUS-
dc.identifier.conferencelocationLas Vegas, NV-
dc.embargo.liftdate9999-12-31-
dc.embargo.terms9999-12-31-
dc.contributor.localauthorKim, Joungho-
dc.contributor.nonIdAuthorJeong, Y.-
dc.contributor.nonIdAuthorLu, A.C.W.-
dc.contributor.nonIdAuthorWai, L.L.-
dc.contributor.nonIdAuthorFan, W.-
dc.contributor.nonIdAuthorLok, B.K.-
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EE-Conference Papers(학술회의논문)
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