DC Field | Value | Language |
---|---|---|
dc.contributor.author | Park, Heung Lak | ko |
dc.contributor.author | Park, Chong Do | ko |
dc.contributor.author | Chun , Soung Soon | ko |
dc.date.accessioned | 2013-02-24T11:08:37Z | - |
dc.date.available | 2013-02-24T11:08:37Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 1988 | - |
dc.identifier.citation | THIN SOLID FILMS, v.166, pp.37 - 43 | - |
dc.identifier.issn | 0040-6090 | - |
dc.identifier.uri | http://hdl.handle.net/10203/56716 | - |
dc.language | English | - |
dc.publisher | Elsevier Science Sa | - |
dc.title | The Deposition Mechanisms and Microstructures of Tungsten Films Produced by Silicon Reduction of WF6 | - |
dc.type | Article | - |
dc.type.rims | ART | - |
dc.citation.volume | 166 | - |
dc.citation.beginningpage | 37 | - |
dc.citation.endingpage | 43 | - |
dc.citation.publicationname | THIN SOLID FILMS | - |
dc.contributor.localauthor | Chun , Soung Soon | - |
dc.contributor.nonIdAuthor | Park, Heung Lak | - |
dc.contributor.nonIdAuthor | Park, Chong Do | - |
dc.description.isOpenAccess | N | - |
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