The Distribution of Deslocations in Copper after Fatigue at Elevated Temprature
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | R. L. Segall | ko |
| dc.contributor.author | Kim, Ho Chul | ko |
| dc.date.accessioned | 2013-02-24T11:07:39Z | - |
| dc.date.available | 2013-02-24T11:07:39Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 1969 | - |
| dc.identifier.citation | CZECHOSLOVAK JOURNAL OF PHYSICS | - |
| dc.identifier.issn | 0011-4626 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/56710 | - |
| dc.language | English | - |
| dc.publisher | Kluwer Academic/Plenum Publishers | - |
| dc.title | The Distribution of Deslocations in Copper after Fatigue at Elevated Temprature | - |
| dc.type | Article | - |
| dc.type.rims | ART | - |
| dc.citation.publicationname | CZECHOSLOVAK JOURNAL OF PHYSICS | - |
| dc.contributor.nonIdAuthor | R. L. Segall | - |
- Appears in Collection
- Files in This Item
- There are no files associated with this item.
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.