The Effect of Descaling Treatments on Intermetallic Formation and Thermomechanical Stability of an Electroplated Tin/Lead Layer in a Semiconductor Leadframe Alloy
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | y.g. kim | ko |
| dc.contributor.author | t.y. chung | ko |
| dc.contributor.author | t.j. cho | ko |
| dc.date.accessioned | 2013-02-24T09:31:24Z | - |
| dc.date.available | 2013-02-24T09:31:24Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 1994 | - |
| dc.identifier.citation | JOURNAL OF MATERIALS SCIENCE LETTERS, v.13, pp.1465 - 1468 | - |
| dc.identifier.issn | 0261-8028 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/56095 | - |
| dc.language | English | - |
| dc.publisher | Chapman and Hall | - |
| dc.title | The Effect of Descaling Treatments on Intermetallic Formation and Thermomechanical Stability of an Electroplated Tin/Lead Layer in a Semiconductor Leadframe Alloy | - |
| dc.type | Article | - |
| dc.type.rims | ART | - |
| dc.citation.volume | 13 | - |
| dc.citation.beginningpage | 1465 | - |
| dc.citation.endingpage | 1468 | - |
| dc.citation.publicationname | JOURNAL OF MATERIALS SCIENCE LETTERS | - |
| dc.contributor.localauthor | y.g. kim | - |
| dc.contributor.nonIdAuthor | t.y. chung | - |
| dc.contributor.nonIdAuthor | t.j. cho | - |
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