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College of Engineering(공과대학)School of Electrical Engineering(전기및전자공학부)EE-Conference Papers(학술회의논문)

Co-modeling and co-simulation of package and on-chip decoupling capacitor for resonant free power/ground network design

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dc.contributor.authorPark, H.ko
dc.contributor.authorKim, H.ko
dc.contributor.authorKam, D.G.ko
dc.contributor.authorKim, Jounghoko
dc.date.accessioned2007-06-20T02:28:54Z-
dc.date.available2007-06-20T02:28:54Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued2005-05-31-
dc.identifier.citation55th Electronic Components and Technology Conference, ECTC, pp.727 - 731-
dc.identifier.issn0569-5503-
dc.identifier.urihttp://hdl.handle.net/10203/543-
dc.languageEnglish-
dc.language.isoen_USen
dc.publisherIEEE-
dc.titleCo-modeling and co-simulation of package and on-chip decoupling capacitor for resonant free power/ground network design-
dc.typeConference-
dc.identifier.wosid000230581600115-
dc.identifier.scopusid2-s2.0-24644442311-
dc.type.rimsCONF-
dc.citation.beginningpage727-
dc.citation.endingpage731-
dc.citation.publicationname55th Electronic Components and Technology Conference, ECTC-
dc.identifier.conferencecountryUS-
dc.identifier.conferencelocationLake Buena Vista, FL-
dc.embargo.liftdate9999-12-31-
dc.embargo.terms9999-12-31-
dc.contributor.localauthorKim, Joungho-
dc.contributor.nonIdAuthorPark, H.-
dc.contributor.nonIdAuthorKim, H.-
dc.contributor.nonIdAuthorKam, D.G.-
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EE-Conference Papers(학술회의논문)
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