DC Field | Value | Language |
---|---|---|
dc.contributor.author | Lee, J. | ko |
dc.contributor.author | Kim, H. | ko |
dc.contributor.author | Kim, Joungho | ko |
dc.date.accessioned | 2007-06-20T02:18:24Z | - |
dc.date.available | 2007-06-20T02:18:24Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2005-08-08 | - |
dc.identifier.citation | International Symposium on Electromagnetic Compatibility, EMC 2005, pp.967 - 970 | - |
dc.identifier.issn | 1077-4076 | - |
dc.identifier.uri | http://hdl.handle.net/10203/539 | - |
dc.language | English | - |
dc.language.iso | en_US | en |
dc.publisher | IEEE | - |
dc.title | Broadband suppression of SSN and radiated emissions using high-DK thin film EBG power distribution network for high-speed digital PCB applications | - |
dc.type | Conference | - |
dc.identifier.wosid | 000232979200184 | - |
dc.identifier.scopusid | 2-s2.0-33744791377 | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 967 | - |
dc.citation.endingpage | 970 | - |
dc.citation.publicationname | International Symposium on Electromagnetic Compatibility, EMC 2005 | - |
dc.identifier.conferencecountry | US | - |
dc.identifier.conferencelocation | Chicago, IL | - |
dc.embargo.liftdate | 9999-12-31 | - |
dc.embargo.terms | 9999-12-31 | - |
dc.contributor.localauthor | Kim, Joungho | - |
dc.contributor.nonIdAuthor | Lee, J. | - |
dc.contributor.nonIdAuthor | Kim, H. | - |
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