전해도금을 이용한 미세 피치 Au bump 제조 방법 및 접합에 관한 연구Fabrication and bonding of fine pitch Au bump by electroplating
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.advisor | 유진 | - |
| dc.contributor.advisor | Yu, Jin | - |
| dc.contributor.author | 최준식 | - |
| dc.contributor.author | Choi, Joon-Sik | - |
| dc.date.accessioned | 2011-12-15T01:46:41Z | - |
| dc.date.available | 2011-12-15T01:46:41Z | - |
| dc.date.issued | 2004 | - |
| dc.identifier.uri | http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=238338&flag=dissertation | - |
| dc.identifier.uri | http://hdl.handle.net/10203/51624 | - |
| dc.description | 학위논문(석사) - 한국과학기술원 : 신소재공학과, 2004.2, [ viii, 76 p. ] | - |
| dc.language | kor | - |
| dc.publisher | 한국과학기술원 | - |
| dc.subject | 본딩 | - |
| dc.subject | 3차원 패키징 | - |
| dc.subject | 패키징 | - |
| dc.subject | 골드 범프 | - |
| dc.subject | 파인피치범프 | - |
| dc.subject | FINE PITCH BUMP | - |
| dc.subject | BONDING | - |
| dc.subject | 3D PACKAGING | - |
| dc.subject | PACKAGING | - |
| dc.subject | AU BUMP | - |
| dc.title | 전해도금을 이용한 미세 피치 Au bump 제조 방법 및 접합에 관한 연구 | - |
| dc.title.alternative | Fabrication and bonding of fine pitch Au bump by electroplating | - |
| dc.type | Thesis(Master) | - |
| dc.identifier.CNRN | 238338/325007 | - |
| dc.description.department | 한국과학기술원 : 신소재공학과, | - |
| dc.identifier.uid | 020023632 | - |
| dc.contributor.localauthor | 최준식 | - |
| dc.contributor.localauthor | Choi, Joon-Sik | - |
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- MS-Theses_Master(석사논문)
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