Dry film photoresist를 이용한 인쇄회로기판용 인듐 솔더 범프 형성 및 플립칩 패키지의 마이크로파 주파수 특성 측정Formation of indium solder bumps on printed circuit board using dry film photoresist and microwave frequency measurement of flip chip package
- Advisors
- 전덕영researcher; Jeon, Duk-Youngresearcher
- Description
- 한국과학기술원 : 신소재공학과,
- Publisher
- 한국과학기술원
- Issue Date
- 2004
- Identifier
- 238331/325007 / 020023470
- Language
- kor
- Description
학위논문(석사) - 한국과학기술원 : 신소재공학과, 2004.2, [ iv, 81 p. ]
- Keywords
마이크로파; 테프론; 인듐솔더범프; 플립칩; DRY FILM PHOTORESIST; MICROWAVE; PTFE; INDIUM SOLDER BUMP; FLIP CHIP
- Appears in Collection
- MS-Theses_Master(석사논문)
- Files in This Item
- There are no files associated with this item.
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