실리콘 웨이퍼 접합을 위한 코발트-주석 금속간화합물에 관한 연구A study on the Co-Sn IMCs for the silicon wafer bonding
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.advisor | 유진 | - |
| dc.contributor.advisor | Yu, Jin | - |
| dc.contributor.author | 김성환 | - |
| dc.contributor.author | Kim, Sung-Hwan | - |
| dc.date.accessioned | 2011-12-15T01:41:20Z | - |
| dc.date.available | 2011-12-15T01:41:20Z | - |
| dc.date.issued | 2008 | - |
| dc.identifier.uri | http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=296351&flag=dissertation | - |
| dc.identifier.uri | http://hdl.handle.net/10203/51296 | - |
| dc.description | 학위논문(석사) - 한국과학기술원 : 신소재공학과, 2008.2, [ vi, 67 p. ] | - |
| dc.language | kor | - |
| dc.publisher | 한국과학기술원 | - |
| dc.subject | 웨이퍼 접합 | - |
| dc.subject | 금속간화합물 | - |
| dc.subject | 코발트-주석 | - |
| dc.subject | 패키징 | - |
| dc.subject | 계면반응 | - |
| dc.subject | wafer bonding | - |
| dc.subject | IMCs | - |
| dc.subject | cobalt-tin | - |
| dc.subject | packaging | - |
| dc.subject | interfacial reaction | - |
| dc.title | 실리콘 웨이퍼 접합을 위한 코발트-주석 금속간화합물에 관한 연구 | - |
| dc.title.alternative | A study on the Co-Sn IMCs for the silicon wafer bonding | - |
| dc.type | Thesis(Master) | - |
| dc.identifier.CNRN | 296351/325007 | - |
| dc.description.department | 한국과학기술원 : 신소재공학과, | - |
| dc.identifier.uid | 020063078 | - |
| dc.contributor.localauthor | 유진 | - |
| dc.contributor.localauthor | Yu, Jin | - |
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