Effects of silica filler and diluent on material properties and reliability of non-conductive pastes (NCPs) for flip-chip applications실리카 필러와 희석제가 플립칩용 비전도성 페이스트의 물성 및 신뢰성에 미치는 영향

Cited 0 time in webofscience Cited 0 time in scopus
  • Hit : 542
  • Download : 0
DC FieldValueLanguage
dc.contributor.advisorPaik, Kyung-Wook-
dc.contributor.advisor백경욱-
dc.contributor.authorJang, Kyung-Woon-
dc.contributor.author장경운-
dc.date.accessioned2011-12-15T01:34:52Z-
dc.date.available2011-12-15T01:34:52Z-
dc.date.issued2003-
dc.identifier.urihttp://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=180258&flag=dissertation-
dc.identifier.urihttp://hdl.handle.net/10203/50894-
dc.description학위논문(석사) - 한국과학기술원 : 재료공학과, 2003.2, [ [iv], 72 p. ]-
dc.description.abstractThe material properties of Non-Conductive Pastes (NCPs) for electronic packaging interconnection materials were investigated to improve reliability and processability of flip chip on organic substrate using NCP in this study. The paste materials composed of low temperature rapid curing epoxy resin, latent curing agent, ceramic fillers and reactive diluents. For the characterization of NCP composites with different content of non-conducting fillers and diluents, differential scanning calorimeter (DSC), thermomechanical analysis (TMA), dynamic mechanical analysis (DMA), thermogravimetric analysis (TGA), HAAKE rheometer, and Brookfield viscometer were used. As the ceramic filler content increased, CTE values decreased and storage modulus at room temperature increased. Also, glass transition temperature increased. As the diluent content increased, viscosity decreased and thixotropic index increased but thermo-mechanical properties such as modulus, CTE, and $T_g$ deteriorated. Daisy chain resistance changes were measured during reliability tests such as thermal cycling, high temperature storage, and high temperature and humidity test. Also, cumulative distribution of connection resistance changes was measured during thermal cycling and high temperature storage test. The reliability results were significantly influenced by CTEs and modulus of NCPs. Especially the reliability result of thermal cycling test was analyzed by Suhir’s model to investigate shear strain induced adhesive layer. The induced shear strain during flip chip assembly process affected the thermal cycling reliability.eng
dc.languageeng-
dc.publisher한국과학기술원-
dc.subjectDiluent-
dc.subjectSilica Filler-
dc.subjectNon-Conductive Pastes-
dc.subjectFlip-Chip-
dc.subjectReliability-
dc.subject신뢰성-
dc.subject희석제-
dc.subject실리카 필러-
dc.subject비전도성 페이스트-
dc.subject플립칩-
dc.titleEffects of silica filler and diluent on material properties and reliability of non-conductive pastes (NCPs) for flip-chip applications-
dc.title.alternative실리카 필러와 희석제가 플립칩용 비전도성 페이스트의 물성 및 신뢰성에 미치는 영향-
dc.typeThesis(Master)-
dc.identifier.CNRN180258/325007-
dc.description.department한국과학기술원 : 재료공학과, -
dc.identifier.uid020013514-
dc.contributor.localauthorPaik, Kyung-Wook-
dc.contributor.localauthor백경욱-
Appears in Collection
MS-Theses_Master(석사논문)
Files in This Item
There are no files associated with this item.

qr_code

  • mendeley

    citeulike


rss_1.0 rss_2.0 atom_1.0