ECR PECVD법을 이용한 SiOF 박막의 증착 특성 및 유전율 안정화에 관한 연구A study on the deposition characteristics and the dielectric stability of the SiOF films deposited by ECR PECVD

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dc.contributor.advisor이원종-
dc.contributor.advisorLee, Won-Jong-
dc.contributor.author변경문-
dc.contributor.authorByun, Kyung-Mun-
dc.date.accessioned2011-12-15T01:32:26Z-
dc.date.available2011-12-15T01:32:26Z-
dc.date.issued1999-
dc.identifier.urihttp://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=150196&flag=dissertation-
dc.identifier.urihttp://hdl.handle.net/10203/50748-
dc.description학위논문(석사) - 한국과학기술원 : 재료공학과, 1999.2, [ viii, 104 p. ]-
dc.languagekor-
dc.publisher한국과학기술원-
dc.subject저유전율-
dc.subject플라즈마-
dc.subjectECR-
dc.subjectSiOF-
dc.subjectLow dielectric constant-
dc.subjectPlasma-
dc.titleECR PECVD법을 이용한 SiOF 박막의 증착 특성 및 유전율 안정화에 관한 연구-
dc.title.alternativeA study on the deposition characteristics and the dielectric stability of the SiOF films deposited by ECR PECVD-
dc.typeThesis(Master)-
dc.identifier.CNRN150196/325007-
dc.description.department한국과학기술원 : 재료공학과, -
dc.identifier.uid000963297-
dc.contributor.localauthor이원종-
dc.contributor.localauthorLee, Won-Jong-
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MS-Theses_Master(석사논문)
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