이온처리된 리드프레임과 EMC와의 접착특성 연구A study on adhesion characteristics between Ion-treated leadframe and epoxy molding compound
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.advisor | 유진 | - |
| dc.contributor.advisor | Yu, Jin | - |
| dc.contributor.author | 한훈 | - |
| dc.contributor.author | Han, Hun | - |
| dc.date.accessioned | 2011-12-15T01:30:56Z | - |
| dc.date.available | 2011-12-15T01:30:56Z | - |
| dc.date.issued | 1997 | - |
| dc.identifier.uri | http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=128150&flag=dissertation | - |
| dc.identifier.uri | http://hdl.handle.net/10203/50657 | - |
| dc.description | 학위논문(석사) - 한국과학기술원 : 재료공학과, 1997.8, [ iii, 61 p. ] | - |
| dc.language | kor | - |
| dc.publisher | 한국과학기술원 | - |
| dc.subject | 에폭시 봉지재 | - |
| dc.subject | 접착 | - |
| dc.subject | Adhesion | - |
| dc.subject | Pull-out test | - |
| dc.subject | Epoxy molding compound | - |
| dc.title | 이온처리된 리드프레임과 EMC와의 접착특성 연구 | - |
| dc.title.alternative | A study on adhesion characteristics between Ion-treated leadframe and epoxy molding compound | - |
| dc.type | Thesis(Master) | - |
| dc.identifier.CNRN | 128150/325007 | - |
| dc.description.department | 한국과학기술원 : 재료공학과, | - |
| dc.identifier.uid | 000957012 | - |
| dc.contributor.localauthor | 유진 | - |
| dc.contributor.localauthor | Yu, Jin | - |
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