반도체 배선용 Cu 박막의 reflow 및 응집 특성Reflow and agglomeration of Cu thin films for the interconnect in semiconductor devices

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Advisors
박종욱researcherPark, Chong-Ookresearcher
Description
한국과학기술원 : 재료공학과,
Publisher
한국과학기술원
Issue Date
1999
Identifier
156001/325007 / 000965287
Language
kor
Description

학위논문(박사) - 한국과학기술원 : 재료공학과, 1999.8, [ iii, 120 p. ]

Keywords

산화; 응집; 배선; 구리; 입자성장; Grain growth; Oxidation; Agglomeration; Reflow; Cu

URI
http://hdl.handle.net/10203/50366
Link
http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=156001&flag=dissertation
Appears in Collection
MS-Theses_Ph.D.(박사논문)
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