전자패키징용 $SiC_p/Al$ 금속복합재료의 제조공정 및 열적특성Fabrication process and thermal properties of $SiC_p/Al$ metal matrix composites for electronic packaging applications
- Advisors
- 홍순형researcher; Hong, Soon-Hyungresearcher
- Description
- 한국과학기술원 : 재료공학과,
- Publisher
- 한국과학기술원
- Issue Date
- 2002
- Identifier
- 174582/325007 / 000965332
- Language
- kor
- Description
학위논문(박사) - 한국과학기술원 : 재료공학과, 2002.2, [ xvi, 199 p. ]
- Keywords
열전도도; SiCp/Al 금속복합재료; SiC 분말 예비성형체; 전자패키징용 열관리 재료; 열팽창계수; Thermal Expansion Coefficient; Thermal Conductivity; SiCp/Al Metal Matrix Compoiste; SiC Particulate Preform; Thermal Management Materials for Elelctronic Packaging
- Appears in Collection
- MS-Theses_Ph.D.(박사논문)
- Files in This Item
- There are no files associated with this item.
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