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Results 1-1 of 1 (Search time: 0.003 seconds).

NO Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
1
Studies on assembly and reliability of Cu/SnAg double-bump flip chip on organic substrates for fine pitch applications = Cu/SnAg 더블 범프를 이용한 미세 피치 플립칩 접속 및 신뢰성에 관한 연구link

Son, Ho-Young; 손호영; Paik, Kyung-Wook; 백경욱, 한국과학기술원, 2008

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