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NO Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
1
Studies on solder bumps coining processes and reliability of assembled flip chip = 솔더 범프 코이닝 공정 및 플립칩 접속 후 신뢰성에 관한 연구link

Nah, Jae-Woong; 나재웅; Paik, Kyung-Wook; 백경욱, 한국과학기술원, 2004

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