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NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
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Electro-thermo-mechanical behavior and reliability of anisotropic conductive polymer adhesives for electronic packaging applications = 전자패키징 접속재료용 이방성 전도 접착제의 열/기계적/전기적 거동 및 신뢰성에 관한 연구link Kwon, Woon-Seong; 권운성; Paik, Kyung-Wook; 백경욱, 한국과학기술원, 2005 |
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