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NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
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Material properties of anisotropic conductive adhesives (ACAs) and flip chip assembly reliability for chip-on-board (COB) applications = Chip-on-Board (COB) 패키지를 위한 이방성 전도성 접착제의 물성 및 플립칩 신뢰성에 관한 연구link Jang, Kyung-Woon; 장경운; Paik, Kyung-Wook; 백경욱, 한국과학기술원, 2008 |
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