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NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
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Ionized Metal Plasma Sputtering 및 Cu Electroplating을 이용한 3-D Packaging용 Through-Si Via Filling에 대한 연구 = Through-Si via filling for 3-D packaging by ionized metal plasma sputtering and Cu electroplatinglink 조병훈; Cho, Byeong-Hoon; 이원종; Lee, Won-Jong, 한국과학기술원, 2008 |
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