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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Circuital Modeling and Measurement of Shielding Effectiveness Against Oblique Incident Plane Wave on Apertures in Multiple Sides of Rectangular Enclosure Shim, Jongjoo; Kam, Dong Gun; Kwon, Jong Hwa; Kim, Joungho, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.52, pp.566 - 577, 2010-08 | |
| Equivalent Circuit Model for Power Bus Design in Multi-Layer PCBs With Via Arrays Kim, Jingook; Shringarpure, Ketan; Fan, Jun; Kim, Joungho; Drewniak, James L., IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.21, no.2, pp.62 - 64, 2011-02 | |
| HIGH-SPEED METAL-SEMICONDUCTOR-METAL PHOTODIODES WITH ER-DOPED GAAS SETHI, S; BROCK, T; BHATTACHARYA, PK; Kim, Joungho; WILLIAMSON, S; CRAIG, D; NEES, J, IEEE ELECTRON DEVICE LETTERS, v.16, no.3, pp.106 - 108, 1995-03 | |
| Inductance Calculations for Plane-Pair Area Fills With Vias in a Power Distribution Network Using a Cavity Model and Partial Inductances Kim, Jingook; Fan, Jun; Ruehli, Albert E.; Kim, Joungho; Drewniak, James L., IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, v.59, no.8, pp.1909 - 1924, 2011-08 | |
| Progress Review of Electromagnetic Compatibility Analysis Technologies for Packages, Printed Circuit Boards, and Novel Interconnects Li, Er-Ping; Wei, Xing-Chang; Cangellaris, Andreas C; Liu, En-Xiao; Zhang, Yao-Jiang; D'Amore, Marcello; Kim, Joungho; Sudo, Toshio, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.52, pp.248 - 265, 2010-05 | |
| Special Section on Through Silicon Vias Foreword Kam, Dong Gun; Kim, Joungho, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.1, no.2, pp.152 - 153, 2011-02 | |
| Embedded microstrip interconnection lines for gigahertz digital circuits Ryu, W; Baik, SH; Kim, H; Kim, J; Sung, MH; Kim, Joungho, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.23, no.3, pp.495 - 503, 2000-08 | |
| Microwave modeling and characterization of anisotropic conductive adhesive flip-chip interconnection Yim, MJ; Jeon, YD; Paik, Kyung-Wook; Ryu, W; Lee, J; Kim, Joungho, JOURNAL OF THE KOREAN PHYSICAL SOCIETY, v.35, pp.753 - 758, 1999-12 | |
| Electrical properties and ultrafast photo-response of InGaAs/InP grown by low-temperature molecular beam epitaxy with a GaAs decomposition source Kim J.M.; Lee Y.T.; Song J.D.; Kim, Joungho, JOURNAL OF CRYSTAL GROWTH, v.265, no.1-2, pp.8 - 13, 2004-04 | |
| Chip-package hybrid clock distribution network and DLL for low jitter clock delivery Daehyun Chung; Chunghyun Ryu; Hyungsoo Kim; Choonheung Lee; Jinhan Kim; Kicheol Bae; Jiheon Yu; Hoijun Yoo; Kim, Joungho, IEEE JOURNAL OF SOLID-STATE CIRCUITS, v.41, no.1, pp.274 - 286, 2006-01 |
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