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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Inductance Calculations for Plane-Pair Area Fills With Vias in a Power Distribution Network Using a Cavity Model and Partial Inductances Kim, Jingook; Fan, Jun; Ruehli, Albert E.; Kim, Joungho; Drewniak, James L., IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, v.59, no.8, pp.1909 - 1924, 2011-08 | |
Application of VSI-EBG Structure to High-Speed Differential Signals for Wideband Suppression of Common-Mode Noise Kim, Myunghoi; Kim, Sukjin; Bae, Bumhee; Cho, Jonghyun; Kim, Joungho; Kim, Jaehoon; Ahn, Do Seob, ETRI JOURNAL, v.35, no.5, pp.827 - 837, 2013-10 | |
| Small-Size Low-Cost Wideband Continuous-Time Linear Passive Equalizer With an Embedded Cavity Structure on a High-Speed Digital Channel Shin, Min-Chul; Kim, Myunghoi; Kim, Ji-Seong; Kim, Joungho; Ahn, Seungyoung, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.4, no.1, pp.94 - 99, 2014-01 | |
| Glass Interposer Electromagnetic Bandgap Structure for Efficient Suppression of Power/Ground Noise Coupling Kim, Youngwoo; Cho, Jonghyun; Kim, Jonghoon J.; Cho, Kyungjun; Kim, Subin; Sitaraman, Srikrishna; Sundaram, Venky; Raj, Pulugurtha Markondeya; Tummala, Rao R.; Kim, Joungho, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.59, no.3, pp.940 - 951, 2017-06 | |
| Glass-Interposer Electromagnetic Bandgap Structure With Defected Ground Plane for Broadband Suppression of Power/Ground Noise Coupling Kim, Youngwoo; Cho, Jonghyun; Cho, Kyungjun; Park, Junyong; Kim, Subin; Kim, Dong-Hyun; Park, Gapyeol; Sitaraman, Srikrishna; Raj, Pulugurtha Markondeya; Tummala, Rao R.; Kim, Joungho, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.9, pp.1493 - 1505, 2017-09 | |
| Miniaturized and high-performance RF packages with ultra-thin glass substrates Kim, Min Suk; Pulugurtha, Markondeya Raj; Kim, Youngwoo; Park, Gap Yeol; Cho, Kyungjun; Smet, Vanessa; Sundaram, Venky; Kim, Joungho; Tummala, Rao, MICROELECTRONICS JOURNAL, v.77, pp.66 - 72, 2018-07 | |
| Thin PCB-Type Metamaterials for Improved Efficiency and Reduced EMF Leakage in Wireless Power Transfer Systems Cho, Yeonje; Kim, Jonghoon; Kim, DongHyun; Lee, Seongsoo; Kim, Hongseok; Song, Chiuk; Kong, Sunkyu; Kim, Hyoungjun; Seo, Chulhun; Ahn, Seungyoung; Kim, Joungho, IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, v.64, no.2, pp.353 - 364, 2016-02 | |
| EMI Reduction Methods in Wireless Power Transfer System for Drone Electrical Charger using Tightly-coupled Three-phase Resonant Magnetic Field Song, Chiuk; Kim, Hongseok; Kim, Youngwoo; Kim, Dong-Hyun; Jeong, Seung Taek; Cho, Yeonje; Lee, Seongsoo; Ahn, Seungyoung; Kim, Joungho, IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS, v.65, no.9, pp.6839 - 6849, 2018-09 | |
| High-Efficiency PCB- and Package-Level Wireless Power Transfer Interconnection Scheme Using Magnetic Field Resonance Coupling Kim, Sukjin; Jung, Daniel Hyunsuk; Kim, Jonghoon J.; Bae, Bumhee; Kong, Sunkyu; Ahn, Seungyoung; Kim, Jonghoon; Kim, Joungho, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.5, no.7, pp.863 - 878, 2015-07 |
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