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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Glass Interposer Electromagnetic Bandgap Structure for Efficient Suppression of Power/Ground Noise Coupling Kim, Youngwoo; Cho, Jonghyun; Kim, Jonghoon J.; Cho, Kyungjun; Kim, Subin; Sitaraman, Srikrishna; Sundaram, Venky; Raj, Pulugurtha Markondeya; Tummala, Rao R.; Kim, Joungho, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.59, no.3, pp.940 - 951, 2017-06 | |
| Nanomechanical Encoding Method Using Enhanced Thermal Concentration on a Metallic Nanobridge Lee, Jeong-Oen; Choi, Kwang-Wook; Choi, Seon-Jin; Kang, Min-Ho; Seo, Min-Ho; Kim, Il-Doo; Yu, Kyoungsik; Yoon, Jun-Bo, ACS NANO, v.11, no.8, pp.7781 - 7789, 2017-08 | |
| Runtime Thermal Management for 3-D Chip-Multiprocessors With Hybrid SRAM/MRAM L2 Cache Lee, Seung Han; Kang, Kyungsu; Kyung, Chong-Min, IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, v.23, no.3, pp.520 - 533, 2015-03 |
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