Browse "EE-Journal Papers(저널논문)" by Subject package
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| A Compact and Wideband Electromagnetic Bandgap Structure Using a Defected Ground Structure for Power/Ground Noise Suppression in Multilayer Packages and PCBs Kim, Myung-Hoi; Koo, Kyoung-Choul; Hwang, Chul-Soon; Shim, Yu-Jeong; Kim, Joung-Ho; Kim, Jong-Hoon, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.54, no.3, pp.689 - 695, 2012-06 |
| High-Efficiency PCB- and Package-Level Wireless Power Transfer Interconnection Scheme Using Magnetic Field Resonance Coupling Kim, Sukjin; Jung, Daniel Hyunsuk; Kim, Jonghoon J.; Bae, Bumhee; Kong, Sunkyu; Ahn, Seungyoung; Kim, Jonghoon; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.5, no.7, pp.863 - 878, 2015-07 |
| Microwave frequency crosstalk model of redistribution line patterns on wafer level package Sung, M.; Kim, N.; Lee, J.; Kim, H.; Choi, B.K.; Kim, J.-M.; Hong, J.-K.; et al, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.25, no.2, pp.265 - 271, 2002-05 |
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