Browse "EE-Journal Papers(저널논문)" by Subject noise isolation
Showing results 1 to 2 of 2
| Modeling and Analysis of Through-Silicon Via (TSV) Noise Coupling and Suppression Using a Guard Ring Cho, Jong-Hyun; Song, Eak-Hwan; Yoon, Ki-Hyun; Pak, Jun-So; Kim, Joo-Hee; Lee, Woo-Jin; Song, Tai-Gon; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.1, no.2, pp.220 - 233, 2011-02 |
| Near-field and far-field analyses of alternating impedance electromagnetic bandgap (AI-EBG) structure for mixed-signal applications Choi, Jinwoo; Kam, Dong Gun; Chung, Daehyun; Srinivasan, Krishna; Govind, Vinu; Kim, Joungho; Swaminathan, Madhavan, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.30, no.2, pp.180 - 190, 2007-05 |
Discover
Open Access
- 573 OA Article
Date issued
- 1,836 2020 - 2024
- 5,085 2010 - 2019
- 4,213 2000 - 2009
- 2,379 1990 - 1999
- 665 1980 - 1989