Browse "EE-Journal Papers(저널논문)" by Author Pak, Jun So
Showing results 1 to 4 of 4
| A Wideband On-Interposer Passive Equalizer Design for Chip-to-Chip 30-Gb/s Serial Data Transmission Kim, Hee-Gon; Cho, Jong-Hyun; Kim, Joo-Hee; Choi, Sumin; Kim, Ki-Yeong; Lee, Junho; Park, Kunwoo; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.5, no.1, pp.28 - 39, 2015-01 |
| High-Frequency Scalable Modeling and Analysis of a Differential Signal Through-Silicon Via Kim, Joo-Hee; Cho, Jong-Hyun; Kim, Joungho; Yook, Jong-Min; Kim, Jun Chul; Lee, Junho; Park, Kunwoo; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.4, no.4, pp.697 - 707, 2014-04 |
| Modeling and Measurement of Power Supply Noise Effects on an Analog-to-Digital Converter Based on a Chip-PCB Hierarchical Power Distribution Network Analysis Bae, Bumhee; Shim, Yujeong; Koo, Kyoungchoul; Cho, Jonghyun; Pak, Jun So; Kim, Joungho, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.55, no.6, pp.1260 - 1270, 2013-12 |
| Modeling and measurement of radiated field emission from a power/ground plane cavity edge excited by a through-hole signal via based on a balanced TLM and via coupling model Pak, Jun So; Kim, Hyungsoo; Lee, Junwoo; Kim, Joungho, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.30, no.1, pp.73 - 85, 2007-02 |
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