Browse "EE-Journal Papers(저널논문)" by Author Pak, JS
Showing results 1 to 3 of 3
| Band-stop filter effect of power/ground plane on through-hole signal via in multilayer PCB Pak, JS; Aoyagi, M; Kikuchi, K; Kim, Joungho, IEICE TRANSACTIONS ON ELECTRONICS, v.E89C, pp.551 - 559, 2006-04 |
| Design of a low-noise UWB transceiver SiP Yoon, CW; Park, YJ; Lee, JW; Park, HJ; Kim, JM; Pak, JS; Kim, Joungho, IEEE DESIGN & TEST OF COMPUTERS, v.25, pp.18 - 28, 2008-01 |
| Suppression of power/ground inductive impedance and simultaneous switching noise using silicon through-via in a 3-D stacked chip package Ryu, C; Park, J; Pak, JS; Lee, K; Oh, T; Kim, Joungho, IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.17, pp.855 - 857, 2007-12 |
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