Browse "EE-Journal Papers(저널논문)" by Author Paik, Kyung-Wook
Showing results 1 to 6 of 6
| A Study on Transmission properties of AuNi coated polymer ball joint and Sn58Bi solder joint for flex-on-board interconnection Zhang, Shuye; Park, Junyong; Park, Gapyeol; Kim, Joungho; Paik, Kyung-Wook; He, Peng, JOURNAL OF ADVANCED JOINING PROCESSES, v.5, 2022-06 |
| Acoustic Matching Layer Films Using B-Stage Thermosetting Polymer Resins for Ultrasound Transducer Applications Park, Jae-Hyeong; Lee, Sang-Mok; Park, Jongcheol; Lee, Hyunjoo Jenny; Paik, Kyung-Wook, IEEE TRANSACTIONS ON ULTRASONICS FERROELECTRICS AND FREQUENCY CONTROL, v.67, no.10, pp.2148 - 2154, 2020-10 |
| Epoxy/BaTiO3 composite films and pastes for high dielectric constant and low-tolerance embedded capacitors fabrication in organic substrates Cho, SD; Jang, KW; Hyun, JG; Lee, S; Paik, Kyung-Wook; Kim, HS; Kim, Joungho, IEEE TRANCSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.28, no.4, pp.297 - 303, 2005-10 |
| High-frequency SPICE model of anisotropic conductive film flip-chip interconnections based on a genetic algorithm Ryu, Woonghwan; Yim, Myung-Jin; Ahn, Seungyoung; Lee, Junho; Kim, Woopoung; Paik, Kyung-Wook; Kim, Joungho, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.23, no.3, pp.542 - 545, 2000-09 |
| Microwave model of anisotropic conductive film flip-chip interconnections for high frequency applications Yim, MJ; Ryu, W; Jeon, YD; Lee, J; Ahn, Seungyoung; Kim, Joungho; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.22, no.4, pp.575 - 581, 1999-12 |
| Microwave modeling and characterization of anisotropic conductive adhesive flip-chip interconnection Yim, MJ; Jeon, YD; Paik, Kyung-Wook; Ryu, W; Lee, J; Kim, Joungho, JOURNAL OF THE KOREAN PHYSICAL SOCIETY, v.35, pp.753 - 758, 1999-12 |
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