Browse "EE-Journal Papers(저널논문)" by Author Fan, Jun
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| Algorithm for Extracting Parameters of the Coupling Capacitance Hysteresis Cycle for TSV Transient Modeling and Robustness Analysis Piersanti, Stefano; Pellegrino, Enza; de Paulis, Francesco; Orlandi, Antonio; Jung, Daniel Hyunsuk; Kim, Dong-Hyun; Kim, Joungho; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.59, no.4, pp.1329 - 1338, 2017-08 |
| Equivalent Circuit Model for Power Bus Design in Multi-Layer PCBs With Via Arrays Kim, Jingook; Shringarpure, Ketan; Fan, Jun; Kim, Joungho; Drewniak, James L., IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.21, no.2, pp.62 - 64, 2011-02 |
| Equivalent Circuit Modeling of Dielectric Hysteresis Loops in Through Silicon Vias Piersanti, Stefano; De Paulis, Francesco; Orlandi, Antonio; Kim, Dong-Hyun; Kim, Joungho; Fan, Jun, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.57, no.6, pp.1510 - 1516, 2015-12 |
| Guest Editorial: Introduction to the Special Issue on EMC for Wireless Power Transfer and Power Electronics Fan, Jun; Carvalho, Nuno Borges; Kim, Joungho, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.61, no.6, pp.1902 - 1903, 2019-12 |
| Inductance Calculations for Plane-Pair Area Fills With Vias in a Power Distribution Network Using a Cavity Model and Partial Inductances Kim, Jingook; Fan, Jun; Ruehli, Albert E.; Kim, Joungho; Drewniak, James L., IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, v.59, no.8, pp.1909 - 1924, 2011-08 |
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