Showing results 1 to 3 of 3
High-Frequency Electrical Characterization of a New Coaxial Silicone Rubber Socket for High-Bandwidth and High-Density Package Test Park, Junyong; Kim, Hyesoo; Kim, Jonghoon J.; Kim, DongHyun; Son, Kyungjune; Kim, Subin; Lee, Seongsoo; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.8, no.12, pp.2152 - 2162, 2018-12 |
High-Frequency Modeling and Signal Integrity Analysis of a Silicone Rubber Socket for High-Performance Package Kim, Hyesoo; Kim, Jonghoon J.; Park, Junyong; Park, Shinyoung; Choi, Sumin; Bae, Bumhee; Ha, DongHo; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.8, pp.1356 - 1368, 2017-08 |
Signal Integrity Design and Analysis of a Multilayer Test Interposer for LPDDR4 Memory Test With Silicone Rubber-Based Sheet Contact Kim, Jonghoon J.; Kim, Hee-Gon; Jung, Daniel Hyunsuk; Choi, Sumin; Lim, Jaemin; Kim, Youngwoo; Park, Junyong; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.59, no.4, pp.1239 - 1251, 2017-08 |
Discover