Browse "EE-Journal Papers(저널논문)" by Author Bae, Bumhee
Showing results 1 to 12 of 12
| 30 Gbps High-Speed Characterization and Channel Performance of Coaxial Through Silicon Via Jung, Daniel Hyunsuk; Kim, Hee-Gon; Kim, Suk Jin; Kim, Jonghoon J.; Bae, Bumhee; Kim, Jonghoon; Yook, Jong-Min; et al, IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.24, no.11, pp.814 - 816, 2014-11 |
| A Novel Stochastic Model-Based Eye-Diagram Estimation Method for 8B/10B and TMDS-Encoded High-Speed Channels Park, Junyong; Choi, Sumin; Kim, Jonghoon J.; Kim, Youngwoo; Lee, Man Ho; Kim, Hee-Gon; Bae, Bumhee; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.60, no.5, pp.1510 - 1519, 2018-10 |
| An Investigation of Electromagnetic Radiated Emission and Interference From Multi-Coil Wireless Power Transfer Systems Using Resonant Magnetic Field Coupling Kong, Sunkyu; Bae, Bumhee; Jung, Daniel Hyunsuk; Kim, Jonghoon J.; Kim, Suk Jin; Song, Chiuk; Kim, Jonghoon; et al, IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, v.63, no.3, pp.833 - 846, 2015-03 |
| Application of Machine Learning for Optimization of 3-D Integrated Circuits and Systems Park, Sung Joo; Bae, Bumhee; Kim, Joungho; Swaminathan, Madhavan, IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, v.25, no.6, pp.1856 - 1865, 2017-06 |
Application of VSI-EBG Structure to High-Speed Differential Signals for Wideband Suppression of Common-Mode Noise Kim, Myunghoi; Kim, Sukjin; Bae, Bumhee; Cho, Jonghyun; Kim, Joungho; Kim, Jaehoon; Ahn, Do Seob, ETRI JOURNAL, v.35, no.5, pp.827 - 837, 2013-10 |
| Chip-Level Simultaneous Switching Current Measurement in Power Distribution Network Using Magnetically Coupled Embedded Current Probing Structure Kim, Jonghoon J.; Cho, Changhyun; Bae, Bumhee; Kim, Suk Jin; Kong, Sunkyu; Kim, Hee-Gon; Jung, Daniel Hyunsuk; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.4, no.12, pp.1963 - 1972, 2014-12 |
| High-Efficiency PCB- and Package-Level Wireless Power Transfer Interconnection Scheme Using Magnetic Field Resonance Coupling Kim, Sukjin; Jung, Daniel Hyunsuk; Kim, Jonghoon J.; Bae, Bumhee; Kong, Sunkyu; Ahn, Seungyoung; Kim, Jonghoon; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.5, no.7, pp.863 - 878, 2015-07 |
| High-Frequency Electrical Characterization of a New Coaxial Silicone Rubber Socket for High-Bandwidth and High-Density Package Test Park, Junyong; Kim, Hyesoo; Kim, Jonghoon J.; Kim, DongHyun; Son, Kyungjune; Kim, Subin; Lee, Seongsoo; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.8, no.12, pp.2152 - 2162, 2018-12 |
| High-Frequency Modeling and Signal Integrity Analysis of a Silicone Rubber Socket for High-Performance Package Kim, Hyesoo; Kim, Jonghoon J.; Park, Junyong; Park, Shinyoung; Choi, Sumin; Bae, Bumhee; Ha, DongHo; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.8, pp.1356 - 1368, 2017-08 |
| Modeling and Measurement of Power Supply Noise Effects on an Analog-to-Digital Converter Based on a Chip-PCB Hierarchical Power Distribution Network Analysis Bae, Bumhee; Shim, Yujeong; Koo, Kyoungchoul; Cho, Jonghyun; Pak, Jun So; Kim, Joungho, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.55, no.6, pp.1260 - 1270, 2013-12 |
| Noise Coupling Effects on CMOS Analog-to-Digital Converter in Magnetic Field Wireless Power Transfer System Using Chip-PCB Comodeling and Simulation Kim, Joung-Ho; Bae, Bumhee; Kim, Jonghoon; Kim, Suk Jin; Kong, Sunkyu, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.57, no.3, pp.329 - 338, 2015-06 |
| Through-Silicon Via Capacitance-Voltage Hysteresis Modeling for 2.5-D and 3-D IC Kim, Dong-Hyun; Kim, Youngwoo; Cho, Jong-Hyun; Bae, Bumhee; Park, Junyong; Lee, Hyunsuk; Lim, Jaemin; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.6, pp.925 - 935, 2017-06 |
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