Lee, Soohwan; Hwang, Seoyeong; Oakley, Ian; Lee, Kyungho, DIS '24: Designing Interactive Systems Conference, 2024-07-04
Lee, Jaewhan; Lee, Jae-Hoon; Kim, Sangsik, 25th European Conference on Integrated Optics, ECIO 2024, pp.540 - 544, 2024-06-19
Choi, Jeongsoo; Park, Se Jin; Kim, Minsu; Ro, Yong Man, IEEE/CVF Conference on Computer Vision and Pattern Recognition, CVPR 2024, 2024-06-19
Taeheon Kim; Sebin Shin; Hak Gu Kim; Ro, Yong Man, IEEE/CVF Conference on Computer Vision and Pattern Recognition, CVPR 2024, 2024-06-19
Choi, Yoojin; Kang, Minhee; Ahn, Heejin, 2024 IEEE Intelligent Vehicle Symposium (IV), 2024-06-02
YEON, INMO; Jeong, Iljoo; Lee, Seungchul; Choi, Jung-Woo, 2024년도 한국음향학회 춘계학술발표대회, pp.335 - 336, 2024-05-30
Choi, Da Yun; Choi, Jung-Woo, 2024년도 한국음향학회 춘계학술발표대회, pp.335 - 336, 2024-05-30
Choi, Soonhyeon; Choi, Jung-Woo, 2024년도 춘계 소음진동 학술대회, 2024-05-23
Choi, Jihoon; Choi, Jung-Woo, 2024년도 춘계 소음진동 학술대회, 2024-05-23
Lee, Dong Heon; Choi, Jung-Woo, 2024년도 춘계 소음진동 학술대회, 2024-05-22
Enhancement of high temperature data retention by La2O3-doped nitride for charge-trap type flash memory device Park, JK; Park, Y; Lee, Seok-Hee; Lim, SK; Oh, JS; Joo, MS; Hong, K; et al, 제18회 한국반도체학술대회, 한국물리학회 반도체분과회, 한국재료학회, 대한전기학회 전기재료 연구회, 2011-02 |
Dramatic increases of dielectric constant Al2O3 by very light doping of La and thermal treatment and its application to flash memory device Park, JK; Lee, Seok-Hee; Lee, KH; Pyi, SH; Cho, Byung Jin, 제 19회 한국반도체학술대회, 고려대학교, 한국반도체산업협회,한국반도체연구조합, 2012-02-17 |
전자파를 이용한 위조지폐 및 권종판별을 위한 무칩 태그 설계 이원석; 오경섭; 유종원, 2012년도 춘계 마이크로파 및 전파전파 학술대회, 대한전자공학회, 2012-05-25 |
Wireless power transfer systems with frequency-insensitive loops 이왕상; 손왕익; 오경섭; 유종원, 대한전자공학회 2011년도 춘계 마이크로파 및 전파전파 학술대회 , 대한전자공학회, 2011-05-27 |
Geometric Properties of 3D Data Represented by DoSurface Kim, HD; Hwang, SS; Kim, Seong-Dae, 2012 International Conference on Electronics, Information and Communication, The Institute of Electronics Engineers of Korea (IEEK), 2012-02-02 |
UHF RFID/GPS 용 이중대역 원형편파 안테나 손왕익; 장형석; 이동진; 이수지; 유종원, 대한전자공학회 2011년도 춘계 마이크로파 및 전파전파 학술대회 , 대한전자공학회, 2011-05-27 |
Vertically Alternating Impedance Electromagnetic Bandgap (VAI-EBG) Structure for Noise Mitigation in Multi-layer PCBs Kim, myunghoi; Koo, Kyoungchoul; Kong, Sunkyu; Bae, Bumhee; Lee, Sangrok; Kim Joungho, 2011 Asia-Pacific Symposium on Electromagnetic Compatibility, 2011 Asia-Pacific Symposium on Electromagnetic Compatibility, 2011-05-17 |
광대역 방향성 결합기를 이용한 UHF RFID 리더용 송수신 Isolator 설계 이원석; 장형석; 임원규; 유종원, 대한전자공학회 2011년도 춘계 마이크로파 및 전파전파 학술대회 , 대한전자공학회, 2011-05-27 |
Design of printable chipless tag using split ring resonators 장형석; 오경섭; 유종원, 대한전자공학회 2011년도 춘계 마이크로파 및 전파전파 학술대회, 대한전자공학회, 2011-05-27 |
An All-Digital Clock Generator Using a Fractionally Injection-Locked Oscillator in 65nm CMOS Park , Pyoungwon; Park, Jaejin; Park, Hojin; Cho, SeongHwan, 2012 IEEE International Solid-State Circuits Conference, ISSCC 2011, pp.336 - 337, IEEE, 2012-02-22 |
A 210 nW 29.3 ppm/C 0.7 V Voltage Reference with a Temperature Range of -50 to 130 C in 0.13 um CMOS Lee, Junghyup; Cho, SeongHwan, IEEE Symposium on VLSI Circuits, pp.278 - 279, IEEE, 2011-06-17 |
High efficiency slim adapter with low profile transformer structure Kim, Duk You; Kim, Chong Eun; Moon, GunWoo, Power Electronics and ECCE Asia (ICPE & ECCE), 2011 IEEE 8th International Conference on, pp.1294 - 1298, IEEE, 2011-05-30 |
Throughput, Energy Consumption, and Energy Efficiency of IEEE 802.15.6 Body Area Network (BAN) MAC Protocol Jung, BH; Usman, A; Sung, Dan Keun, IEEE PIMRC 2012, IEEE, 2012-09 |
A Group-based Communication Scheme based on the Location information of MTC Devices in Cellular Networks Lee, K; Shin J; Cho, K; Ko, KS; Sung, Dan Keun; Shin, H, IEEE ICC 2012, IEEE, 2012-06 |
Modeling and analysis of an energy-efficient sleep-mode operation in IEEE 802.16e system Chu,EM; Jung, BH; Sung, Dan Keun; Park, YJ, IEEE ICC 2012, IEEE, 2012-06 |
Energy-Efficient Subchannel Allocation Scheme Based on Adaptive Base Station Cooperation in Downlink Cellular Networks Bang, IK; KIM, SH; Kim, SM; Sung, Dan Keun, IEEE WCNC 2012, IEEE, 2012-04 |
A chip scale wafer level packaging for LED using surface aligning technique Kim, Jin Kwan; Lee, Hee Chul, AWAD, 2012 Asia-Pacific Workshop on Fundamentals and Applications of Advanced Semiconductor Devices, 2012-06 |
Design Method for Radiation Hardened Integrated Circuit 이민수; 이희철, 제 19회 반도체 학술대회, 2012-02 |
Fabrication of integrated temperature sensor for wafer level packaged LED 강인구; 김진관; 이희철, The 14th Korean MEMS Conference, 2012-04 |
New Method for Thin Organic Film Fabrication on Flexible Substrate Kim, Woo Young; Lee, Hee Chul, AWAD (Asia-Pacific Workshop on Fundamentals and Applications of Advanced Semiconductor Devices), 2011-07 |
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